Technology

ITEM

TECHNICAL PARAMETER

LAYERS

1-24

Max.Board SizeSingle

650mm×610mm      25.6″x24″

Board Thickness

     0.25-6.0mm        10mil-152.4mil

Min. Line Width

                  0.075mm           3mil

Min Space

                  0.075mm           3mil

Min Hole Size(Mechanical)

                  0.2mm             8mil

Min Hole Size (Laser)

                  0.10mm            4mil

PTH Wall Thickness

                >0.025mm         1mil

PTH Hole Dia Tolerance

                 ±0.076mm        3mil

Non PTH Hole Dia Tolerance

                  ±0.05mm         2mil

Hole Position Deviation

                  ±0.05mm         2mil

Outline Tolerance

                  ±0.13mm         3mil

V-cut

30°/45°/60°

Impedance control

50 – 90 ohms +/- 8%100 – 155 ohms +/- 10%

Max  copper weight(inner)

6 oz

Peel-off Strength

1.4N/mm

Soldermask Abrasion

>7H

Solderability Test

260℃20 second

Flammability

94v0

E-test Voltage

50-300v

Bow/Twist

≤0.75%

Surface finishing

HAL、Entek、Flash gold、Gold finger
Immersion gold、Immersion Tin、Immersion Silver、Lead free HAL

Material

FR4,Tg 130℃/Tg170℃,Rogers, (taconic)

 

PCB boards Pictures

2LayerPCB
2Layer PCB
BlindSlotPCB
Blind-slot-PCB
2LayerENIGPCB
2 Layer ENIG
2LayerPCB
2 Layer PCB
AluminumPCB
Aluminum PCB
4LayerOSP
4Layer OSP
4LayerImpedancePCB
4L ENIG Impedance
IVHPCB
I.V.H PCB
8LayerPCB
8LayerLeadFree
4Layer
4Layer-HAL
MultilayerPCB
4L ENIG DISPLAYBOARD
4LayerImpedance
4Layer Impedance
MultilayerPCB
4 Layer PCBA
PCBA
12 Layer PCBA

 

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